Nano/Micromechanical Testing
Heterogeneous integration of different semiconductors - or packaging of semiconductors, requires consideration of the stability of interfaces between different semiconductors (such as GaN and diamond), or between the device and the metal based package (die attach). Characterizing this stability is critically important in enabling advanced technology to become reality. We develop and use advanced micromechanical testing techniques that quantify the stability of interfaces and gain a physical understanding of fracture in these material systems. The technique uses micro-cantilever testing, or more standard nano-indentation.
Figure 1. Micromechanical testing of GaN-Diamond interface strength
Figure 2. Micromechanical testing of GaN-on-Diamond
Figure 3. Controlled nanoindentation on 2D materials
Figure 4. Typical indentation-displacement curve