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Unit information: Device Interconnect - Principles and Practice in 2018/19

Please note: It is possible that the information shown for future academic years may change due to developments in the relevant academic field. Optional unit availability varies depending on both staffing and student choice.

Unit name Device Interconnect - Principles and Practice
Unit code EENGM4230
Credit points 10
Level of study M/7
Teaching block(s) Teaching Block 2 (weeks 13 - 24)
Unit director Dr. Mellios
Open unit status Not open
Pre-requisites

None

Co-requisites

None

School/department Department of Electrical & Electronic Engineering
Faculty Faculty of Engineering

Description

Modern electronic systems are composed of interconnected devices, communicating in various ways, closely or loosely coupled and at a variety of distances of separation and voltage. A number of techniques and standards have grown up to facilitate this, and they demonstrate a wide range of complexity and performance capability according to their specific application domain: on-chip chip-to-chip, backplane/motherboard, network/switch-fabric, etc.

This unit addresses the practical issues which arise when it is required to transmit high speed signals over moderate distances, such as USB or Ethernet cable, and over short distances, such as between components on a Printed Circuit Board or Integrated Circuit.

By looking at the physics of what happens within a PCB and on an interconnecting cable, principles will be established which, if followed, will lead to designs which are more reliable.

Elements

  • Transmission line structures and their properties
  • Crosstalk due to mutual inductance and capacitance
  • Signal Integrity problems including ringing, ground bounce and echo
  • Differential signalling, Differential and Common Mode currents
  • Use of image planes and the design of multi-layer Printed Circuit Boards
  • Modelling and prediction of interconnect properties
  • Case studies of some practical interconnects: USB, HDMI, IDE etc.

Intended learning outcomes

On successful completion of the unit a student will be able to:

  1. Apply transmission line and electromagnetic theory to the successful design of interconnections within a Printed Circuit Board and over cable
  2. Describe the precautions which need to be taken in the design of high speed PCBs in order to achieve good performance
  3. Describe the properties of transmission line structures
  4. Explain mutual inductance and capacitance in interconnects
  5. Explain cross-talk, ground-bounce and signal integrity
  6. Describe electromagnetic interference and radiation
  7. Describe the use of image planes and multi-layer Printed Circuit Boards

Teaching details

Lectures and laboratory

Assessment Details

Report on PCB-PCB connection laboratory, 20% (all ILOs)

Exam, 2 hours, 80% (all ILOs)

Reading and References

Strongly recommended:

  • Johnson, H., & Graham, M., High-Speed Digital Design, Prentice Hall, ISBN:0133957241

Recommended:

  • Hall, S.H., H, G.W., & McCall, J.A., High-Speed Digital System Design, Wiley-IEEE Press, ISBN:0471360902

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